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Process Capabilities

Process Capabilities

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PROCESS CAPABILITIES

 

SPECIFICATIONS Capabilities Y2024 Capabilities Y2025 SPECIFICATIONS Capabilities Y2024 Capabilities Y2025
Max.board thickness 3.2mm 4.0mm Min outer trace width 0.075mm 0.05mm
Min.board thickness 0.4mm 0.4mm Min outer trace space 0.075mm 0.05mm
Min.inter Cu thickness 0.5oz 0.5oz Min.SMD pad 0.20mm 0.15mm
Max.outer Cu thickness 6oz 8oz Min. isolating ring Drill+0.15mm Drill+0.15mm
Min.outer Cu thickness 3/8oz 1/3oz Interlayer offset 0.05mm 0.035mm
Max.Layer 18 layer 24 layer Pattern/solder mask accuracy ±0.05mm ±0.035mm
Min.hole diameters 0.20mm 0.15mm Impedance Tolerance ±8% ±5%
Finished Hole Tolerance PTH ±0.05mm NPTH ±0.025mm PTH ±0.05mm NPTH ±0.025mm Working panel size 622~722mm 622~722mm
Hole position tolerance ±0.05mm ±0.05mm Shipping panel size 80~700mm 80~700mm
Aspect  Ratio 12:1 15:1 Min.hole space 0.3mm 0.25mm
Min inter trace width 0.075mm 0.05mm Bow/Twist 0.75% 0.5%
Min inter trace space 0.075mm 0.05mm Quality standard IPC class 3 IPC class 3

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Head Office: 23/F, Delta House, 3 On Yiu Street, Shek Mun, Shatin, N.T., Hong Kong 

Qingyuan Factory Location: 

Circular Economy Industrial Park Of Kingboard, Shijiao Town, Qingcheng District, Qingyuan City, Guangdong Province, China

 

Dongguan Factory Location:

NO.107 CHAJING RD IND CHASHAN DONGGUAN GUANGDONG CN

 

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